RCO-6000-RPL
Industrial Computer w/ LGA 1700 for Intel 12/13/14th Gen CPU & R680E PCH
RCO-6000-RPL series is an extreme features integration, outstanding system performance, versatile I/O connections, and rugged reliability fanless embedded systems. It offers dramatically enhanced CPU and graphics performance, wide power and feature scalability, and advanced features, modularize expansion I/O, rich connectivity interfaces, wide range (9~48V) DC power input, and high reliability even operating in temperature extremes (-25°C~70°C).
Featuring with completely cable-less designed, high functional, one-piece housing design, and anti-vibration, RCO-6000-RPL series are ruggedized systems that can operate in harsh environments and easy to install and maintain. A build in over voltage protection (OVP), over current protection (OCP), reverse protection, and wide range DC power input makes RCO-6000-RPL series are safety system for all industrial applications.
- LGA 1700 socket for 12/13/14th Gen. Intel® ADL & RPL Processor (65W/35W TDP)
- Intel® R680E Chipset
- 2x DDR5 4800/5600MHz SODIMM. Max. up to 64GB
- Triple Independent Display: 2x DisplayPort, 1x DVI-I
- 2x Intel® 2.5 GbE supporting Wake-on-LAN and PXE
- 1x Full-size Mini PCIe for communication or expansion modules, 2x SIM socket
- 1x 9mm 2.5" SATA SSD (Internal), 1x 7mm 2.5" SATA SSD (Hot-swap), Support RAID 0, 1
- 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
- 1x M.2 (B Key, 2242/3042/3052, PCIe x2, Support AI Module/NVMe Storage, PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
- 6x RS-232/422/485 (4x internal), 8x USB 3.2 Gen 2, 1x USB 3.2 Gen 1 (internal)
- 8x DI + 8x DO with isolation
- 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
- Wide Operating Temperature -25°C to 70°C (35W CPU); -25°C to 60°C (65W CPU)
- TPM 2.0 Supported
| Processor | |
|---|---|
| Processor | Support 12/13th/14th(Non-vPRO) Gen Intel® ADL & RPL Processor (LGA 1700, 65W/35W TDP) Intel® Core™ i9-14900/i9-13900E/i9-12900E, up to 24 Cores, 36MB Cache, up to 5.8 GHz, 65W Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5.5 GHz, 35W Intel® Core™ i7-14700, up to 20 Cores, 33MB Cache, up to 5.4 GHz, 65W Intel® Core™ i7-14700T, up to 20 Cores, 33MB Cache, up to 5.2 GHz, 35W Intel® Core™ i7-13700E/i7-12700E, up to 16 Core, 30MB Cache, up to 5.1 GHz, 65W Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W Intel® Core™ i5-14500/i5-13500E/i5-12500E, up to 14 Cores, 24MB Cache, up to 5.0 GHz, 65 W Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.8 GHz, 35W Intel® Core™ i3-13100E/i3-12100E, up to 8 Cores, 12MB cache, up to 4.4 GHz, 60W Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.4 GHz, 35W Intel® Core™ 300T, up to 2 Cores, 6MB Cache, up to 3.4 GHz, 35W Intel® Pentium® G7400E,2 Cores, 6MB Cache, 3.6 GHz, 46W Intel® Pentium® G7400TE, 2 Cores, 6MB Cache, 3.0 GHz, 35W Intel® Celeron® G6900E, 2 Cores, 4MB Cache, 3.0 GHz, 46W Intel® Celeron® G6900TE, 2 Cores, 4MB Cache, 2.4 GHz, 35W |
| System Chipset | Intel® R680E Express Chipset |
| LAN Chipset | 2.5 GbE1: Intel I226, 2.5 GbE2: Intel I226 Support Wake-on-LAN and PXE, Support TSN |
| Audio Codec | Realtek ALC888S |
| System Memory | 2x 262-Pin DDR5 4800/5600MHz SODIMM. Max. up to 64GB (ECC and Non-ECC) |
| Graphics | Intel® UHD Graphics 770/710 |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| TPM | TPM 2.0 |
| Display | |
|---|---|
| Display Port | 2x DisplayPort, support resolution 5120 x 3200, up to 7680 x 4320 |
| DVI | 1x DVI-I, support resolution 1920 x 1200 |
| Multiple Display | Triple Display |
| VGA | Yes (by optional split cable) |
| Storage | |
|---|---|
| M.2 | 1x M.2 B Key, 2242/3042/3052 (PCIe x2, Support AI Module/NVMe Storage) (PCIe x1 & USB 3.2 Gen1, Support 4G/5G) |
| mSATA | 1x mSATA (Shared by 1x Mini PCI Express) |
| SIM Socket | 2x External SIM socket (Mini PCIE/M.2 B Key attached) |
| SSD/HDD | 1x 9mm 2.5" SATA HDD Bay (Internal) 1x 7mm 2.5" SATA HDD Bay (Hot-swappable) Support RAID 0, 1 |
| Expansion | |
|---|---|
| M.2 | 1x M.2 (E Key, PCIe x1, USB 2.0, 2230) |
| Mini PCIe | 1x Full-size Mini PCIe (1x shared by 1x mSATA) |
Expansion Modules
2x EDGEBoost I/O Brackets:
- 4-port GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional)
- 2-Port RJ45 10GbE with Intel X710 Chipset
- 4-Port USB 3.0 (share PCIe Gen2 x1 bandwidth)
- 1x M.2 B-Key, 2242 for AI/NVMe, 1x M.2 B-Key, 3042/3052 for 5G/AI/NVMe
- 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for AI Module/NVMe
- 1x M.2 for 5G (B Key, PCIe x1, USB 3.0, 3042/3052), 2x SIM socket, 1x SIM switch
| Operating System | |
|---|---|
| Windows | Windows 10 |
| Linux | Linux kernel |
| I/O | |
|---|---|
| Audio | 1x Mic-in, 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 2x RS-232/422/485; 4x RS-232/422/485 (internal) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x RJ45 |
| EDGEBoost I/O Bracket | 2x EDGEBoost I/O Bracket (By mini PCIe interface) |
| USB | 8x USB 3.2 Gen 2 (10 Gbps) 1x USB 3.2 Gen 1 (5 Gbps, 1x Internal) 2x USB 2.0 (internal) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x Removable CMOS Battery |
| Power | |
|---|---|
| Power Adapter | Optional AC/DC 24V/9.2A, 220W |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Power Ignition Management |
| Power Supply Voltage | 9~48VDC |
| Power Connector | 5-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection) OCP (Over Current Protection) Reverse Protection |
| Environment | |
|---|---|
| Operating Temperature | -25°C to 70°C (35W CPU) -25°C to 60°C (65W CPU) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | UL 62368 Ed.3, CE, FCC Class A |
| Vibration | IEC60068-2-64:2008 With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Physical | |
|---|---|
| Dimensions | 240 (W) x 261 (D) x 79 (H) mm |
| Weights | 4.5 kg |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting |
- For 12/13/14th CPUs configured to run at 65W, operating temperatures will be limited to 60°C.
- 65W CPUS may experience thermal throttling depending on extreme application workloads; this is also due to an increase in the physical CPU cores from the Intel silicon (up to 24 cores). Please note, this does not indicate system malfunction or problems in the fanless design. Please consult our embedded engineers for the best configuration to match your application requirements.
- All product specifications and information are subject without notice.