RCO-3000-CML
Superior Fanless Embedded System with LGA 1200 for Intel 10th Gen CPU & Q470E PCH
The RCO-3000-CML Series brings powerful computing power to harsh industrial settings. At the heart of the RCO-3000-CML Series is Intel’s 10th Generation advanced processors (codename: Comet Lake S) and Q470E Chipset, enabling advanced processing in volatile, demanding, and mobile deployments.
- Supports 10th Gen Intel® CML S Processor (LGA 1200, 35W TDP)
- Intel® Q470E Express Chipset
- Triple Independent Display by 3x DisplayPort
- 2x Intel® GbE supporting Wake-on-LAN and PXE
- 1x Full-size Mini PCIe and 2x External SIM socket
- 2x 2.5” SATA HDD Bay (1x Internal) with RAID 0, 1, 5 support, 1x mSATA
- 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
- 5x RS-232/422/485 (2x internal)
- 6x USB 3.2 Gen 2 (10 Gbps), 2x USB 3.2 Gen 1 (internal)
- 8x DI + 8x DO with isolation
- 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
- Wide Operating Temperature (-25°C to 70°C)
- TPM 2.0 Supported
- UL Listed
| Processor | |
|---|---|
| Processor | Supports 10th Gen Intel® CML S Processor (LGA 1200, 35W TDP) Intel® Core™ i9-10900TE, 10 Cores, 20MB Cache, up to 4.5 GHz, TDP 35W Intel® Core™ i7-10700TE, 8 Cores, 16MB cache, up to 4.4 GHz, TDP 35W Intel® Core™ i5-10500TE, 6 Core, 12MB Cache, up to 3.7 GHz, TDP 35W Intel® Core™ i3-10100TE, 4 Cores, 9MB Cache, up to 3.6 GHz, TDP 35W Intel® Pentium® G6400TE, 2 Cores, 4MB Cache, 3.2 GHz, TDP 35W Intel® Celeron® G5900TE, 2 Cores, 2MB Cache, 3.0 GHz, TDP 35W |
| System Chipset | Intel® Q470E Express Chipset |
| LAN Chipset | GbE1: Intel I219 (Support Wake-on-LAN and PXE) 2.5 GbE2: Intel I225 (Support Wake-on-LAN and PXE) |
| Audio Codec | Realtek ALC888S |
| System Memory | 2x 260-Pin DDR4 2666/2933MHz SODIMM. Max. up to 64GB |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| TPM | TPM 2.0 |
| Display | |
|---|---|
| Display Port | 3x DisplayPort, support resolution 4096 x 2304 (1x DP Port Co-layout HDMI Connector) |
| HDMI | Yes, Shared by 1x DP port |
| Multiple Display | Triple Display |
| Storage | |
|---|---|
| mSATA | 1x mSATA |
| SIM Socket | 2x External SIM socket (Mini PCIe attached) |
| SSD/HDD | 1x Internal 2.5" SATA HDD Bay (support H=9mm) 1x Removable 2.5" SATA HDD Bay (support H=7mm, hot-swappable) Support RAID 0, 1, 5 |
| Expansion | |
|---|---|
| M.2 | 1x M.2 (E Key, PCIe x1, USB 2.0, 2230) 1x M.2 B Key, 2242/3042/3052 (PCIex2, Support AI Module/NVMe Storage) (PCIex1&USB 3.2 Gen1, Support 4G/5G) |
| Mini PCIe | 1x Full-size Mini PCIe |
Expansion Modules
Occupies One Universal I/O Slot:
- 4-port GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional)
- 2-Port RJ45 10GbE with Intel X710 Chipset
- 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth)
- 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module
- 2x M.2 B-Key 2242/3042/3052:
- 2x M.2 (PCIe x2 Lane) for NVMe/AI Module
- 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached)
| Operating System | |
|---|---|
| Windows | Windows 10 |
| Linux | Linux kernel |
| I/O | |
|---|---|
| Audio | 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 2x RS-232/422/485 ; 2x RS-232/422/485 (internal) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x RJ45 |
| Universal I/O Bracket | 1x Universal I/O Bracket (By mini PCIe interface) |
| USB | 6x USB 3.2 Gen 2 (10 Gbps) 1x USB 3.2 Gen 1 (5 Gbps, Internal) 1x USB 2.0 (internal) |
| Others | 5x WiFi Antenna Holes 1x Power Switch 1x AT/ATX Switch 1x Remote Power On/Off 1x PC/Car Mode Switch 1x Delay Time Switch 1x Removable CMOS Battery 1x 4-PIN FAN Connector |
| Power | |
|---|---|
| Power Adapter | Optional AC/DC 24V/5A, 120W Optional AC/DC 24V/9.2A, 220W |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Power Ignition Management |
| Power Supply Voltage | 9~48VDC |
| Power Connector | 3-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection) OCP (Over Current Protection) Reverse Protection |
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
| Environment | |
|---|---|
| Operating Temperature | -25°C to 70°C (35W CPU) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | UL, CE, FCC Class A EMC Conformity with EN50155 & EN50121-3-2 |
| Vibration | IEC60068-2-64:2008 With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis With HDD: 1 Grms, 5 - 500 Hz, 0.5 hr/axis |
| Shock | IEC60068-2-27:2008 With SSD: 50G, half sine, 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Physical | |
|---|---|
| Dimensions | 192 (W) x 227 (D) x 60.3 (H) mm |
| Weights | 3.3~4.1 kg |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting |
- For 10th generation CPUs configured to run at 35W, operating temperatures will be limited to 70°C.
- 35W CPUS may experience thermal throttling depending on extreme application workloads; this is also due to an increase in the physical CPU cores from the Intel silicon (up to 10 cores). Please note, this does not indicate system malfunction or problems in the fanless design. Please consult our embedded engineers for the best configuration to match your application requirements.
- All specifications and photos are subject to change without notice.